| 1. | The processing characteristics and some material properties of silicon wafers depend on the orientation .
硅片的工艺性质与某些材料特性均与晶向有关。 |
| 2. | The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。 |
| 3. | Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer .
光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。 |
| 4. | Visual inspection for silicon wafers with specular surfaces
镜面硅片的目视检查 |
| 5. | Visual inspection for sliced and lapped silicon wafers
切制硅片及磨光硅片的目视检查 |
| 6. | Hot plate with silicon wafer lowered to heating position
加热板与矽晶圆降低至加热位置。 |
| 7. | Afm investigations of process of cu thin films deposited on silicon wafers
基上沉积成核的演化过程 |
| 8. | Mechanical test wafer - a silicon wafer used for testing purposes
机械测试晶圆片-用于测试的晶圆片。 |
| 9. | On the other hand , is a silicon wafer that a core resides on
而芯片（ chip ）是将核心封装起来的一块硅片。 |
| 10. | Hot plate with silicon wafer in initial configuration ( before heating )
加热板与矽晶圆在启始状态（加热前） 。 |
